Taiwan Semiconductor launches automotive-grade power MOSFETs in PDFN56U package

Taiwan Semiconductor has introduced the TQM series of AEC-Q automotive-grade power MOSFETs in a wettable-flank PDFN56U package. The new parts are aimed at 48V automotive systems, industrial power, and other high-reliability applications, with samples in stock now and production lead times of 8-14 weeks.

Why it matters: - Taiwan Semiconductor is targeting designers that need automotive-grade power devices with easier assembly, stronger thermal performance, and package compatibility for existing layouts. - The new package is also positioned for high-reliability non-automotive uses, including server power and industrial control.

What happened: - Taiwan Semiconductor introduced the TQM series of automotive-grade n-channel power MOSFETs on June 9, 2026. - The devices are offered in 40V and 60V versions. - The MOSFETs use a wettable-flank PDFN56U package with a 5mm x 6mm footprint. - The package supports drop-in pin compatibility with TDSON-8, LFPAK56 and DFN5x6 packages.

The details: - The wettable-flank connections are designed to support automated placement. - The package is intended to meet automotive board-mount testing, AEC-Q qualification testing and high-yield manufacturability needs. - The low-profile design uses heat-spreader contacts for thermal management and higher power density. - Taiwan Semiconductor says the package can support 48V automotive systems, industrial applications, solenoid and motor control, server power, and high-reliability DC-DC converters. - The series includes three part numbers: TQM033NB04CR, TQM150NB04CR and TQM050NB06CR. - Design resources include datasheets, spice models and CAD files for the symbol, footprint and 3D model. - Samples are in stock at DigiKey and Mouser. - Production quantities carry an 8-14 week lead time after receipt of order.

Between the lines: - The package strategy points to a focus on design-ins where footprint reuse can shorten qualification time and lower the cost of switching parts. - Wettable-flank packaging is especially relevant for automotive manufacturing because it can improve solder inspection and process reliability. - Sam Wang, vice president of TSC Products, said PDFN56U compatibility with TDSON-8, LFPAK56 and DFN5x6 packages makes drop-in replacement straightforward. - Wang also said the AEC-Q quality and reliability are useful in non-automotive applications that require high reliability.

What’s next: - Engineers can begin evaluating samples immediately through distribution. - Taiwan Semiconductor expects production shipments to follow within the stated 8-14 week lead time. - Broader adoption will likely depend on qualification results and customer validation in automotive and industrial designs.

The bottom line: - Taiwan Semiconductor is using a compact, automotive-ready package to make power MOSFET swaps easier while broadening the parts’ appeal beyond vehicles.