AGP Executive Report
Last update: 6 hours agoAI Hardware & Pricing Pressure: Morgan Stanley warns “chipflation” is spreading beyond data centers as memory prices have surged sixfold in a year, squeezing device makers from PCs to smartphones and raising broader inflation and margin stress. Semiconductor & AI Ecosystems: At Computex, Qualcomm pushed the “agents” wave, while Nvidia highlighted new RTX Spark chips for AI-ready Windows laptops—though memory shortages could lift prices. Power Electronics & Motor Drives: EPC launched compact eGaN BLDC inverter evaluation boards (EPC91128–EPC91131) to speed next-gen robotics and industrial motor control development. Data Center Cooling Funding: ZutaCore secured $100M Series C to scale waterless, direct-to-chip two-phase liquid cooling for AI/HPC racks. Optical Interconnects: MediaTek showcased MicroLED-based optical links and co-packaged optics aimed at higher bandwidth and lower power for AI data centers. Policy Push for Deep Tech: India’s Maharashtra approved draft quantum and deep-tech policies to attract investment and startups, with final cabinet approval pending. Cybersecurity AI Access: Korea joined Anthropic’s Project Glasswing to expand access to the Mythos security model for vulnerability detection. Electronics Recycling & Circular Tech: Phobio for Business won a 2026 MSP Today Product of the Year award for managed device buyback and renewed value.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.