AGP Executive Report
Last update: 2 hours agoMemory & AI Supply Chain: Micron broke ground on a ¥1.5T ($9.3B) Hiroshima expansion to make AI-focused HBM, with shipments targeted for summer 2028, supported by up to ¥500B in Japanese subsidies. Power Semiconductors: Infineon opened its “Smart Power Fab” in Dresden, billed as the world’s largest power-chip plant, aimed at automotive, industrial, and renewable energy demand. Enterprise Storage: Samsung began mass production of its PM1763 PCIe Gen6 AI/HPC SSD, targeting faster data movement for next-gen servers. Apple Silicon Manufacturing: Apple signed a multiyear $30B+ deal with Broadcom for US-made custom chips, including wireless connectivity components, with Broadcom expanding Fort Collins by $1.5B. Market Moves: SK hynix set pricing for a mega Nasdaq listing expected to raise about $28B, while Luxshare’s HK debut drew attention after raising ~$3.1B. IoT Privacy Tech: Researchers reported a moisture-activated stretchable battery designed to permanently disable certain IoT sensors as a privacy safeguard.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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