AGP Executive Report
Last update: 29 minutes agoAI Memory Push: Samsung and SK hynix are commercializing CXL-based pooled memory to expand AI capacity beyond stacking HBM alone, with SK hynix showing a 256GB CMM-DDR5 CXL 3.2 sample and Samsung targeting year-end production (timelines may slip). Data-Center Connectivity: Prysmian signed a deal worth up to €5.5B with Molex for optical cables for data centers, aiming for €10B+ cumulative revenue by 2035 and €1.1B annual revenue by 2031, plus major US/Europe fibre expansion. Semiconductor Capex: TSMC plans an additional 148 trillion won investment in Arizona to meet long-term AI chip demand, while Samsung Electronics America cuts 739 roles in New Jersey and more in Texas despite record chip profits. Market Mood: South Korea’s KOSPI slid nearly 5% into technical bear territory as AI and chip stocks sold off, with Middle East tensions lifting oil prices. Cooling for AI Racks: Critical Resources hired a liquid-cooling adviser to advance its two-phase spray cooling tech aimed at chiller-free data center heat removal. India Chip Policy: India approved Semicon 2.0 (₹1.27 lakh crore) with design-linked incentives and co-investment to scale advanced chip development. EV Electronics: TVS Sensing Solutions will buy 51% of EV motor/controller maker Weber Drivetrain to build electronics capabilities for electric mobility.
Note: AI summary from news headlines; neutral sources weighted more to help reduce bias in the result. Feedback is welcome. Please let us know if you have any comments or suggestions about the AGP Executive Report.
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