Semiconductor momentum in Asia: TSMC says it has doubled advanced packaging capacity for three straight years, while Samsung pushes 2nm mass production and both firms align on deferring High-NA EUV to around the 1nm era (~2030). AI speeds chip design: Samsung is using Anthropic’s Claude to cut SoC verification timelines dramatically, aiming to ease design-talent pressure. Memory and China hardware shift: CXMT’s rise to China’s most valuable firm signals a tilt toward Beijing-aligned hardware players as private tech giants cool. Semiconductor IP results: Qualitas Semiconductor posted a sharp revenue jump but still reported an operating loss, tied to Samsung foundry adoption of its interface IP. Manufacturing automation suppliers: China’s Hongdali highlights integrated assembly-line tables, conveyor systems, and technical support as buyers chase faster commissioning and fewer bottlenecks. Logistics for electronics: UPS is expanding its Clark hub in the Philippines for a September 2026 go-live, targeting later air-freight cut-offs and earlier deliveries for electronics, semiconductors, and healthcare. Safety and incidents: A Delhi warehouse fire killed two after an e-rickshaw battery explosion; separate reports note a near-miss fire on a British Airways apron likely linked to lithium batteries. Policy and compliance: India’s government is reportedly pushing ministries to set up quick response teams to counter fake social media content within two hours. Space work outlook: A space-industry CEO predicts moon commuting and jobs tied to mining, data centers, and power-grid building by the 2030s.